controlled collapse chip connection
| ceramic ball grid array package
| controlled collapse chip connection | |
| el. | 可控熔塌 芯片连接; 可控熔塌 芯片连接 |
| ceramic ball grid array package | |
| el. | 陶瓷网格焊球阵列封装; 陶瓷球栅阵列封装 |
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| 可控熔塌高度芯片连接技术; 可控熔塌高度芯片连接 | |||
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controlled collapse chip connection : 6 phrases in 1 subject |
| Electronics | 6 |