| Subject | English | Chinese simplified |
| comp., MS | flip chip packaging | 倒装芯片封装 (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
| comp., MS | packaging material | 包装材料 (The material used to bundle goods for protection during shipment) |
| comp., MS | User Solution Packaging | 用户解决方案封装 (An approach that packages together all content deployable to SharePoint -- list templates, list instance, site template, files and declarative workflows) |