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Subject: Lifted ball bonds, wire sweep gen. Речь идет о различных видах применения промышленных рентгеновских систем компьютерной томографии, а именно для обнаружения дефектов electronic and electrical components: печатных плат, корпусов BGA, flip-chip, wirebonds etc. У меня здесь два вопроса: что может значить следующее?1) Lifted ball bonds 2)Wire sweep Кроме этих двух выражений, есть такие: Broken wedge bonds, die attach, Pppulated and unpopulated PCBs (это я для контекста - их я как смогла перевела). Очень прошу помощи специалиста. Заранее благодарю. |
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link 1.07.2013 21:39 |
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1) метод металлизации с монтажом шариков припоя с приподнятием с поверхности 2) контекст |
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L_S, зачем сочиняете? Bond lifting is a common problem in the wirebonding process of semiconductor manufacturing. Bond lifting can be caused by a multitude of factors, ranging from contamination of the bond pads to improper wirebonding equipment set-up. Below is an archived forum thread discussing the common causes of lifted ball bonds. Bond lifting refers to any of several phenomena in which a wire bond that connects the device to the outside world becomes detached from its position, resulting in loss or degradation of electrical and mechanical connection between that bond and its bonding site. In this context, a bond may be one that attaches to a bond pad of the die (also referred to as the first bond) or one that attaches to a lead or post of the package (also referred to as the second bond). First bonds are usually in the form of gold ball bonds or aluminum wedge bonds, while second bonds are usually gold or aluminum crescent bonds (also known as 'fishtail' bonds). Ball bond lifting, or simply ball lifting, is the detachment of a ball bond from the bond pad of a semiconductor device. It can be due to a variety of factors. Poor wire bond equipment set-up and bond pad surface contamination are primary causes of ball lifting. Poor set-up includes improper wirebond parameter settings, unstable workpiece holders, and worn-out wirebonding tools. These result in poor initial welding and inadequate intermetallic formation between the bond pad and the ball. |
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link 1.07.2013 21:58 |
| Так по-русски просят. Я и сам так могу. |
| Спасибо за подсказки и ссылки. Пытаюсь разобраться. Но вот по поводу wire sweep - так ничего и не получается. И контекста нет. Просто идет перечисление разных дефектов, насколько я понимаю. |
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уход (смещение) проводников, нахлест (пересечение) проводников imho |
| Спасибо, PicaPica! |
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