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| technique de conditionnement de la puce retournée (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) | |||
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| technique de conditionnement de la puce retournée (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) | |||