 |
| |||
| interconnection bonding | |||
| lead attachment; lead bonding | |||
| присоединение выводов: 60 phrases in 9 subjects |
| Communications | 1 |
| Electronics | 13 |
| Makarov | 4 |
| Mass media | 1 |
| Microelectronics | 20 |
| Oil and gas | 1 |
| Scientific | 1 |
| Semiconductors | 2 |
| Technology | 17 |
|
| |||
| interconnection bonding | |||
| lead attachment; lead bonding | |||
| присоединение выводов: 60 phrases in 9 subjects |
| Communications | 1 |
| Electronics | 13 |
| Makarov | 4 |
| Mass media | 1 |
| Microelectronics | 20 |
| Oil and gas | 1 |
| Scientific | 1 |
| Semiconductors | 2 |
| Technology | 17 |