| Russian | English |
| монтаж методом перевёрнутой микросхемы | flip chip packaging (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
| непосредственный монтаж микросхемы на плате | COB (A manufacturing technology that mounts an integrated circuit die directly to a circuit board. The die is electrically connected to the circuit board using wire bonding, and is then covered with a protective epoxy cover) |
| непосредственный монтаж микросхемы на плате | chip-on-board (A manufacturing technology that mounts an integrated circuit die directly to a circuit board. The die is electrically connected to the circuit board using wire bonding, and is then covered with a protective epoxy cover) |
