| Subject | English | Chinese Taiwan |
| comp., MS | chip-on-board | 板面晶片 (A manufacturing technology that mounts an integrated circuit die directly to a circuit board. The die is electrically connected to the circuit board using wire bonding, and is then covered with a protective epoxy cover) |
| comp., MS | flip chip packaging | 覆晶封裝 (A packaging technique that connects die bond pads to a package substrate without using wire bonds. The bumped die is placed on the package substrate where the bumps connect to the package pins) |
| comp., MS | on-chip performance counter | 晶片上的效能計數器 (A register on a CPU chip that stores very low-level information. This information can be queried) |
