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 din-88

link 30.11.2010 19:19 
Subject: Помогите пожалуйста с переводом выражения
Здравствуйте! Не подскажите как переводится Post application bake (PAB) здесь

Hydrogen terminated silicon substrates were freshly pre¬pared for all experimental procedures (modified IMEC clean [13]). Resist films were made by dissolving MF07-01 in a casting solvent such as chloroform or anisole, with solution strength of 1 to 20 g/1 and spin coating at speeds of in the range 600-3000 rpm for 60 s. Post application bake (PAB) was applied where noted. CA films were prepared by adding crosslinker and photoacid generator to the cast¬ing solution in appropriate ratios. Here the MF07-01:CL:PAG ratio was 1:2:1 by weight in all cases. Smooth films of uniform thickness and low defectivity could be pre¬pared, as discussed elsewhere [14].

 Snark

link 30.11.2010 20:45 
Похоже на термообработку (сушку) после нанесения.

 

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