Технический перевод

[El_NInho]

Помогите перевести предложение:
Bonding pads for input|output are backside overglass cuts to the top tier first metal layer.
Контактные площадки для ввода вывода расположены на обратной стороне, а дальше слово overglass не знаю как переводить.
Заранее спасибо.

[PicaPica]

are backside over glass cuts

[El_NInho]

ну так это разные вещи!

[awoman]

Overglass

The entire circuit is covered by a thick insulator layer to prevent the degradation of the fabricated structure by the interaction with its environment. This insulator layer is called a passivation layer and in most circuits has holes only at the locations of the electrical contacts of the circuit to the outside world, which are called bonding pads. The overglass layer is usually drawn where the holes in the passivation layer are intended. It should then actually be called overglass cut. The passivation layer absorbs electromagnetic radiation and additionally has a strongly wavelength-dependent optical transmission due to interference effects. It may therefore be desirable to use overglass cuts at the locations of photodiodes and of areas where exposure to ultraviolet radiation (for example, to facilitate electron tunneling) will occur.